10 txoj kev npaj rau ceramic atomization core hlau cua sov txheej

Cov luam yeeb hluav taws xob tseem ceeb hauv kev lag luam tam sim no siv ceramic lossis paj rwb cores kom ua tiav cov teebmeem atomization. Txawm hais tias lawv yog tag nrho cov paj rwb cores, tuaj yeem muaj cov cua sov sib txawv, paj rwb, thiab lwm yam; Ib yam li ntawd, txawm tias lawv txhua tus hu ua ceramic cores, txoj kev siv los yog cov qauv yuav txawv.
Ceramic substrates, nrog rau lawv cov yam ntxwv zoo heev xws li tsis tshua muaj thermal tsis kam, siab tsis kam, siab kub dissipation, thiab kev pab lub neej ntev, muaj ntau yam ntawm daim ntawv thov kev cia siab nyob rau hauv lub teb ntawm hluav taws xob fumigation thiab cua sov tsis combustion. Kev ua haujlwm ntawm cov khoom siv hluav taws xob hluav taws xob hluav taws xob zoo ib yam li cov khoos phis tawj rau Intel chips, thiab cov khoom siv hluav taws xob metallization nyob rau saum npoo ntawm ceramic substrates yog qhov tseem ceeb ua ntej rau nws daim ntawv thov.
Cov txheej txheem metallization nto ntawm ceramics muaj ntau yam kev siv hauv hluav taws xob ceramics. Vim nws cov lus teb cua kub ceev, nws daim ntawv thov hauv kev lag luam luam yeeb tau maj mam nthuav dav. Cov hauv qab no yog ib qho kev taw qhia rau saum npoo metalization txheej txheem ntawm ceramic substrates muab tso ua ke los ntawm tus editor rau siv;
1. Thick film technology
Thick zaj duab xis thev naus laus zis suav nrog kev tshuaj ntsuam luam ntawv ntawm cov hmoov hlau slurry ntawm ceramics, ua raws li kev kub kub sintering thiab degreasing kom yaj cov hmoov hlau rau hauv tag nrho.
2. DPC Direct Phaj Copper
Sputtering tooj liab txheej yog hais txog kev siv lub tshuab nqus tsev sputtering rau saum npoo ntawm Direct Plate Copper (DPC) kom ua tiav cov yeeb yaj kiab metallization, tom qab los ntawm kev sib txuas ntawm ob sab thiab ntsug sib txuas nrog lub teeb daj daj ua ke nrog perforation electroplating.
3. Bonded Copper Clad (DBC)
Direct Bond Copper (DPC) yog ib hom khoom sib txuas uas cuam tshuam nrog kev tso nyiaj tooj liab rau ntawm qhov chaw ceramic. Thaum kub kub, tshuaj lom neeg cov tshuaj tiv thaiv tshwm sim nyob rau hauv lub interface los tsim ib tug tshiab theem, CuAlO2 los yog vermilion, uas yog nruj nreem khi. Qhov kom zoo dua ntawm cov txheej txheem no yog tias nws tsim nyog rau kev ua haujlwm thib ob, nrog cov txheej tooj liab tuab thiab muaj kev ntseeg siab tshaj plaws.
4. Bonded Aluminium Txheej (DBA)
Direct Bond Aluminium (DPA) yog ib hom kev sib txuas cov khoom siv uas siv cov khoom ntub dej zoo heev ntawm txhuas ntawm ceramics hauv cov kua hauv lub xeev kom ua tiav kev sib txuas ntawm ob. Los ntawm melting aluminium thiab ncaj qha ntub nws mus rau saum npoo ntawm ceramics, cov txheej txheem kev sib txuas tau tiav. Thaum qhov kub nce mus txog 660 degree, cov khoom txhuas ua rau liquefaction. Tom qab ntub cov ceramic nto nrog kua txhuas, raws li qhov kub thiab txias, aluminium ncaj qha muab cov khoom siv lead ua thiab kev loj hlob ntawm cov nplais ceramic, thiab txias rau chav sov kom ua tiav qhov sib xyaw ua ke ntawm ob.
5. Active technology brazing
Active hlau solder yog luam tawm nyob rau saum npoo ntawm ceramics, thiab nws yog welded nrog oxygen dawb tooj liab ntawv ci nyob rau hauv lub tshuab nqus tsev brazing rauv. Lub voj voog saum npoo yog tsim los siv cov txheej txheem ntub dej ntawm PCB board. Brazing muaj me me deformation, du thiab zoo nkauj cov pob qij txha, thiab yog haum rau vuam cov khoom uas yog meej, complex, thiab muaj li ntawm cov khoom sib txawv.
6. Laser Selective Sintering (LAM)
Siv high-zog laser beams kom excite ceramic thiab hlau ions, khov kho ob leeg.
7. Tshuaj plating
Tshuaj plating tshuab yog cov txheej txheem deposition ntawm hlau los ntawm kev tswj oxidation-txo cov tshuaj tiv thaiv nyob rau hauv lub catalytic kev txiav txim ntawm hlau.
8. Thermal txau
Txau cov khoom siv molten txau (hlau lossis tsis yog hlau) rau saum npoo ntawm cov khoom siv ua ntej los ntawm cov cua kub ceev.
9. Plasma txau
Siv cov plasma arc kom sov cov hlau kom yaj, thiab tom qab ntawd cuam tshuam rau saum npoo ntawm lub substrate nyob rau hauv lub traction ntawm cov ntshav ntws.
10. Molybdenum manganese txoj kev
Sib tov molybdenum manganese hmoov nrog cov organic binder los ua ib qho muab tshuaj txhuam, siv rau saum npoo ntawm ceramics, sinter ntawm qhov kub thiab txias hauv qhov chaw kom tau txais metallization, ces npib tsib xee plating, thiab thaum kawg brazing nrog solder rau hlau qhov chaw.
Cov luam yeeb hauv hluav taws xob, ua ib yam khoom siv hauv qhov ncauj, muaj cov kev xav tau siab rau qib kev nyab xeeb khoom noj. Txoj kev siv ntau tshaj plaws hauv cov luam yeeb hauv hluav taws xob yog cov yeeb yaj kiab tuab, uas yog siv rau hauv cov cua sov uas tsis yog hluav taws xob thiab e-kua hluav taws xob luam yeeb nrog cov khoom cua sov.
Qhov kom zoo dua ntawm cov cuab yeej ua yeeb yaj kiab tuab yog nyob rau hauv kev muaj peev xwm tsim ntau yam kev sib txuas rau cov khoom ntawm tib qhov loj thiab cov nqi tsis kam, ua rau cov khoom sib txawv; Lub hom phiaj tsim cov khoom lag luam kom ua tiav cov khoom siv hluav taws xob zoo tshaj plaws, ua kom muaj cua sov zoo thiab atomization cuam tshuam, thiab txhim kho thermal efficiency kom txuag hluav taws xob.